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| www..com SPECIFICATIONS FOR CHIP LED MODEL: WR-PB3216SR/C WENRUN OPTOELECTRONIC WENRUN CHIP LED www..com No. WR-PB3216SR/C Part No. Emitted Color Chip Material High Red GaAlAs WR-PB3216SR/C Len's Color Water Clear Features: Compatible with automatic placement equipment Compatible with reflow solder process Low power consumption and wide viewing angle Applications: Automotive and Telecommunication Flat backlight for LCD ,switch and symbol in telephone and fax General use for indicators Package Dimensions: 1.1 1.6 0.5 0.5 0.6 Cathode _ 3.2 1.8 2 Cathode mark + Anode Resin P.C.board Unit : mm Tolerance: 0.1 Electrodes: Au Plating Encapsulating Resin: Epoxy Resin Package: BT Resin Prepared date June 2005 http://www.wenrun.com Rev. 3 Page 1of 6 WENRUN CHIP LED www..com No. WR-PB3216SR/C Absolute Maximum Rating Parameter Ta=25 Symbol PM IFP Max. 50 60 20 5 -20 -30 85 100 Unit Mw mA mA V Power Dissipation Pulse Forward Current (1/10 duty and 1mec width) Continuous Forward Current Reverse Voltage Operating Temperature Range Storage Temperature Range IF VR Topr Tstg Electrical Optical Characteristics Parameter Luminous Intensity Forward Voltage Reverse Current Dominant Wavelength Spectral Line Half Width Viewing Angle 2 1/2 Ta=25 Max. -2.3 10 ---Unit mcd V uA nm nm Deg. Test Condition IF =10mA IF =10mA VR=5V IF=10mA IF=10mA IF =10mA Symbol IV VF IR d Typ. 25 1.8 -645 30 125 Parameter Classification Forward Voltage IF=10mA Code E F Min~Max 1.7~1.8 1.8~1.9 Code T U Dominant Wavelength IF=10mA Min~Max 640~643 643~646 Code F G Luminous Intensity IF=10mA Min~Max 20~27 27~35 Classing Marking: For example Code Order Prepared date 006EUOOF Chip code Voltage Dominant Wavelength OO Luminous Intensity http://www.wenrun.com Rev. 3 Page 2of 6 June 2005 WENRUN CHIP LED www..com No. WR-PB3216SR/C Package Label: Manufacturer Part No. Classing Code Quantity Sealing Date (year-month-day) Soldering Pad Dimensions: 1.5 2 Soldering Conditions (Maximum allowable soldering conditions) 1 Reflow soldering profile 1~5 /sec. 260 Max. 10sec.Max. 1.5 2~5 /sec. 240 Max. 10sec.Max. 1~5 /sec. Pre-heating 180~200 60sec.Max. . Above 220 2~5 /sec. Pre-heating 120~150 60sec.Max. . Above 200 . 120sec.Max. . 120sec.Max. 2 Soldering Iron Power dissipation of Iron should be smaller than 25W,and temperature should be controllable.The work must be finished within 3sec under 320 , only once. * Do not stress its resin while soldering. * After soldering,do not warp the circuit board. Prepared date June 2005 http://www.wenrun.com Rev. 3 Page 3of 6 WENRUN CHIP LED www..com No. WR-PB3216SR/C Package Tape Specifications: (3000 pcs/Reel) 180 60 2 _ 1.5 1.75 13 0.2 9.0 0.1 12.0 0.15 4 0.2 3.5 8.0 + 1.0 Polarity 4 1.82 Reel Lead Min.60mm No LEDs 470 225 225 250 60 320 5 Reel in one Box 10 Box in one Carton Prepared date June 2005 http://www.wenrun.com Rev. 3 Page 4of 6 3.5 1.27 WENRUN CHIP LED www..com No. WR-PB3216SR/C Typical Electro-Optical Characteristics Curves Relative Luminous Intensity (%) 100 Relative Luminous Intensity Vs. Wavelength Ta=25 Forward Current (mA) 100 50 30 20 10 Forward Current Vs. Forward Voltage Ta=25 75 50 25 0 580 620 660 700 0 1.0 1.5 2.0 2.5 3.0 3.5 Wavelength (nm) Forward Voltage (V) Forward Current Vs Ambient Temperature 50 Relative Luminosity(%) Forward Current(mA) 40 30 20 10 0 0 20 40 60 80 100 Ambient Temperature Ta ( C) 200 175 150 125 100 75 50 25 0 0 Forward Current Vs Relative Luminosity Ta=25 10 20 30 40 50 Forward Current (mA) Relative Luminosity Vs Ambient Temperature If=20mA 200 Relative Luminosity (%) -40 150 -50 -60 -70 50 0 0 20 40 60 80 100 Ambient Temperature Ta ( C) -80 -90 1.0 0.5 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 0 Radiation Angle 0.5 1.0 Prepared date June 2005 http://www.wenrun.com Rev. 3 Page 5of 6 WENRUN CHIP LED www..com No. WR-PB3216SR/C Reliability Test Items and Conditions Test Item Temperature Cycle High Temp. Storage -30 30min Test Conditions 25 5min 100 30min 25 5min Duration 50clycles 1000hours 1000hours 1000hours 1000hours 1times Sample 100 100 100 100 100 20 Ac/Re 0/1 0/1 0/1 0/1 0/1 0/1 NO 1 2 3 4 5 6 Ta=100 Ta=85 RH=85% Temp.& Humidity Test Low Temp. Storage Operating Life Test Solder Heat Ta=-30 Ta=25 5 DC IF=15mA 10s Tsol=260 5 Cautions 1 Package When moisture is absorbed into the package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. So the moisture proof package is used to keep moisture to a minimum in the package. 2 Storage Before opening the package: The LEDs should be kept at 5~30C and 60%RH or less. The LEDs should be used within a year. After opening the package: The LED must be used within 24 hours, else should be kept at 5~30 and 30% RH or less. The LEDs should be used within 7days after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. If the LEDs have exceeded the storage time, baking treatment should be performed more than 12 hours at 60 5C. 3 The LED electrode sections are comprised of a gold plated. The gold surface may be affected by environments which contain corrosive gases and so on. Please avoid conditions which may cause the LED to corrode or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the User use the LEDs as soon as possible. 4 Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. Notes: 1 Above specification may be changed without notice. We will reserve authority on material change for above specification. 2 When using this product, please observe the absolute maximum ratings and the instructions for the specification sheets. We assume no responsibility for any damage resulting from use of the product which does not comply with the instructions included in the specification sheets. Prepared date June 2005 http://www.wenrun.com Rev. 3 Page 6of 6 |
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